CSCPS 2014

2nd International Workshop on

compressive Sensing in Cyber-Physical Systems

Co-located with the 11th IEEE International Conference on Mobile Ad hoc and Sensor Systems (MASS) 2014 – Philadelphia, Pennsylvania -October 27, 2014.

8:00 a.m.-4:30 p.m, Temple University Center City


Cyber physical systems (CPS) are distributed complex systems that integrate computing and physical processes to facilitate ubiquitous, intelligent machine-to-machine (M2M) interactions among internet of things (IoT). To realize many grand visions of CPS applications, transformative signal and information processing paradigms are needed.

In this workshop, potential applications of compressive Sensing (CS) to CPS system information processing will be focused. CS represent an energy efficient way of interacting (sampling) the physical world by integrating data compression and sampling into a single process, and thereby significantly reduce computation overhead and energy waste. Despite this great promise, many key questions remain in terms of seamless integration of the CS technology and the CPS system development.

This workshop will provide and open forum for researchers to present their work in exploring the great potential of compressive sensing in various CPS applications.

Topics of interests include but not limited to:

  • Sparsity and compressive sensing
  • Compressive sensing on manifolds and embedding
  • Compressed signal and information processing
  • Compressive sensing scheme in Cyber Physical System(WSN/IOT)
  • Compressive wireless communication
  • Compressive sensing in network protocol
  • Compressive mobile sensing
  • Efficient compressive sensing algorithms
  • Practical sensing system design and applications


The workshop solicits submissions of manuscripts that represent significant and novel research contributions. All submissions should is restricted to 6 pages (IEEE Computer Society Proceedings Manuscripts style: two columns, single-spaced), and authors can get additional 2 pages at $150/page. Paper submissions must be anonymous, with no author names, affiliations, or obvious references. Accepted papers will be published in the IEEE Digital Library after the conference and included in MASS 2014 proceedings, and selected best papers will be recommended to a special issue of International Journal of Distributed Sensor Networks (SCIE).

Important Dates

  • Paper submission deadline: July 31, 2014  extended to August 12th, 2014
  • Paper acceptance notification: August 19, 2014
  • Camera ready manuscript submission: August 26, 2014

Paper submission Link:


Each paper requires a registration. One registration can cover two papers. Atendees must register via IEEE MASS 2014 conference. The deadline of early bird registration is 9/17.  Please, refer to IEEE MASS 2014 registration page for more details.


  • Program chair:

Professor Yu Hen Hu, University of Wisconsin-Madison, US
Associate Professor Zhi Wang, Zhejiang University, China

  • Technical Program Chairs:

Professor Luis Almeida, University of Porto, Portugal
Professor Gang Li, Zhejiang University of Technology, China
Professor Hairong Qi, The University of Tennessee Knoxville, US
Professor Husheng Li, The University of Tennessee Knoxville, US

  • Technical Program Committee:

Professor Guoan Bi, Nanyang Technological University, Singapore
Assistant Professor Marco F. Duarte, University of Massachusetts Amherst, US
Researcher Wei Chen, University of Cambridge, UK
Professor Luca Santinelli, INRIA, France
Professor Yeqiong Song, University of Lorraine, France
Professor Chun Tung Chou, The University of New South Wales, Australia
Professor Carlo Fischione, KTH Royal Institute of Technology, Sweden
Professor Ming Bao, Institute of Acoustics, Chinese Academy of Sciences, China
Professor Zhiping Lin, Nanyang Technological University, Singapore
Previous workshop

1st international workshop on Compressive Sensing in Cyber-Physical System will be held on October 13, 2013 in Hangzhou, China, during IEEE MASS2013 ( or The workshop includes a keynote speech, 5 submitted presentations and more than 30 attendees.